Deep Learning For Failure Analysis & Process Engineering

Harness the Power of Computer Vision to Streamline Failure Analysis

Discover the power of uncovering minuscule imperfections in the nano world, all at lightning speed.
Even the tiniest flaws in the micro world can unleash significant complications in the larger realm of technology.

As nanotechnology, material science, and semiconductor manufacturing technologies continue to evolve, everything gets smaller. However, the nanotechnology also amplifies the impact of minor defects on semiconductors, materials, and MEMS.

Fortunately, Deep Block's cutting-edge machine vision technology, integrated with its ultra-high-resolution microscope image analysis, emerges as the ultimate solution to conquer these intricate challenges and eliminate imperfections.

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Why are high-resolution images difficult to analyze?

Discover the countless challenges posed by large-volume, high-resolution images.

Discover the incredible challenges presented by large-volume, high-resolution images. These images are truly massive in terms of their size. Simply rendering high-resolution images on the front-end is a complex task, and combining such enormous images with machine vision technology poses an even greater challenge.

Due to their size and resolution, these images need to be divided and analyzed. However, this process brings a lot of problems, including speed problem and the potential loss of features when analyzing the countless pieces of the image.

Fortunately, by harnessing the power of Deep Block's computer vision technology specifically designed for ultra-high resolution images, your microscopic image analysis can be effortlessly automated, making it incredibly easy.

What We Do

Failure Analysis & Characterization

While the thin film remains unseen to our unaided vision, it reveals itself as a THICK layer when magnified by an electron microscope.

We are very interested in the step coverage, morphology, and composition of each layer, but we rely on our eyes to see the thickness and connectivity of the numerous gates and metals that exist in the HUGE WAFER OCEAN.

Take control of your Micrograph analysis today without any coding knowledge. Create your own machine learning model and harness the power of our state-of-the-art machine vision technology. Trust Deep Block to gain insight into thin film morphology.

TEM, STEM

To assess the Epitaxial Layer's growth, we use TEM or STEM imaging techniques on the sample.
Traditionally, this required a manual inspection to ascertain the perfection of the single crystal layer formation.
However, this process has now been revolutionized through DEEP BLOCK.
Capture a detailed, extensive cross-section snapshot using a high voltage e-beam, and upload the image to DEEP BLOCK.
DEEP BLOCK flawlessly segments the layers, ensuring no minuscule crystal layer goes unnoticed.

Process Engineering

Guarantee the accuracy of each layer's deposition and review your production procedure.
Minor deviations in layer thickness or unexpected errors in the etching process can significantly compromise the integrity of the chip manufacturing operation, leading to product failure.
The introduction of advanced technologies, such as glass substrates and hybrid bonding, necessitates the adoption of microscopy for their inspection.
Leverage the transformative potential of machine learning to seamlessly assess layer thickness and structure, substantially improving your quality assurance protocols.